SFB1006 GOOT

Japan Goot Silver Soldering 100 G 0.6mm Sf-b 1006

100g 0.6mm High performance lead-free solder sf series (Rosin core) Product characteristics The temperature changes caused by heat and cooling of electronic components can cause welding tin fractures, high performance lead-free solder sf series has excellent anti-solder fracture characteristics, and, it does not contain lead that is harmful to humans. Generally speaking, compared with lead-containing eutectic solder, the melting temperature and melting time vary. The melting point of this product is higher than that of eutectic solder、 low incidence of welding tin fracture、 creep properties have improved greatly. Ingredients: Tin 99%、 silver 0.3%、 copper 0.7% Weight: 100g Diameter: Diameter 0.6mm Melting point: 216-227 degrees